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TS652D Thermal Release Tape for Wafer Dicing & Semiconductor Backgrinding | Heat-Activated No-Residue Temporary Bonding Tape PET 110-140C | MLCC LED

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Shenzhen KHJ Technology Co., Ltd

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TS652D Thermal Release Tape for Wafer Dicing & Semiconductor Backgrinding | Heat-Activated No-Residue Temporary Bonding Tape PET 110-140C | MLCC LED

Model Number : TS652D

Brand Name : KHJ

Certification : RoHS

Place of Origin : ShenZhen

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Description

TS652D is a white film backed pressure-sensitive adhesive single- sided coated thermal release tape.With a high initial adhesion and easily peel off by heating under a certain high temperature (110-140°C) .

TS652D Thermal Release Tape for Wafer Dicing & Semiconductor Backgrinding | Heat-Activated No-Residue Temporary Bonding Tape PET 110-140C | MLCC LED

Features

* High initial adhesion and certain heat resistance ,no sticking back

* After heating ,easy to peel off and no any residual.

* Excellent tensile strength & Elongation

* RoHS Compliant

Application

* For electronic component ,glasses ,wafer ,ceramics manufacturing processes.

* For various temporary fixing

Item		Typical Value		Test Method
		Imperial	Metric
Backing		4mils	0.1mm	/
Total Thickness		6mils	0.15mm	/
180°peel force(N/25mm)	Before heating	1.98lbs/in	9N/25mm	GBT 2792-2014
	After heating	0	0

Recommended heating release Temperature: 110-140℃*5-15min (depending on the thermal conductivity and heating uniformity of the object )

Storage

Store under normal conditions of 10-30℃ and 40-70% R.H, out of direct sunlight.
Shelf life: 6 months from the date of manufacture when stored in initial packing.

Precaution Reminder

Surface should be clean, dry, free of dust, oil or other contaminants.
Proper pressure required by roller, hand or press when applying.
Avoid repeat sticking to prevent adhesion decrease.

Notes

Please be advised that this technical data sheet is written based on our lab tests and experience only. Customer is responsible to determine the suitability of the product meets intended application requirements before approved for use.

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TS652D Thermal Release Tape for Wafer Dicing & Semiconductor Backgrinding | Heat-Activated No-Residue Temporary Bonding Tape PET 110-140C | MLCC LED Images

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