TS652D Thermal Release Tape for Wafer Dicing & Semiconductor Backgrinding | Heat

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Semiconductor Packaing Tape [2]
smt spilice tool [8]
SMT Splice Tape & tool [35]
SMT Stencil Cleaning Wiper [7]
Thermal Release Tape [5]
UV Release Tape [3]
ESD Adhesive Tape [16]
Masking Tape [10]
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Polyimide Heat Resistant Tape [26]
Heat Resistant Double Sided Tape [5]
Polyester Adhesive Tape [3]
Adhesive Tape Roll [7]
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Precision Die Cutting [12]
Kapton Tape [3]
Discontinued Models [3]

Shenzhen KHJ Technology Co., Ltd

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TS652D Thermal Release Tape for Wafer Dicing & Semiconductor Backgrinding | Heat

Contact Now

TS652D Thermal Release Tape for Wafer Dicing & Semiconductor Backgrinding | Heat

Description TS652D is a white film backed pressure-sensitive adhesive single- sided coated thermal release tape.With a high initial adhesion and easily peel off by heating under a certain high ...

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